Solder paste application
Solder paste application is a next step in PCB prototype production after PCB miiling. Solder paste can be applied by stencil printer or by pneumatic dispenser. Both methods have its own advantages, but solder paste dispensing is in prototyping more often. Solder paste can be applied manualy when operator holds the syrringe with solder paste in hand or more precizely, when syrringe is fixed in manipulator and with pneumatic dispensing controller the solder paste can be precizely applied to soldering pads on the PCB.
Dispensing controller 982B provides accurate and regular dispensing of many types of gel fluxes, solder pastes, adhesives, silica gel, etc. A foot switch is available for ease...
As an option for SMT manipulator 4PLACE with vision the 10cc syrringe holder can be provided. Manipulator assembled with dispensing head in connection with dispensing controller...
The 4PRINT is compact desktop stencil printer for solder paste printing during PCB prototyping in your lab.